Abstract
Electrochemical technology is applied to a large number of products in the modern electronics industry.(1–3) Various manufacturing processes leading to important commercial implementations in the computer industry are based on the study, understanding, and direct utilization of double-layer phenomena. The objective of this chapter is to describe in some detail how double-layer theory is being utilized for the development of two rather different products.
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References
L. T. Rmankiw, Oberfläche-Surfaces 25, 238 (1984).
D. P. Seraphim and I. Feinberg, IBM J. Res. Dev. 25, 617 (1981).
D. P. Seraphim, R. Lasky, and C. Yu-Li, Principles of Electronic Packaging, McGraw-Hill, New York, (1989).
C. J. Sambucetti, J. Varsic, and W. Laboy, in: Proceedings of the Symposium on Electrochemical Technology in Electronics, Honolulu, Hawaii, Proceedings Vol. 88-23, pp. 59-62, The Electrochemical Society, Pennington, New Jersey (1987).
J. O.’M Bockris, M. A. V. Devanathan, and K. Müller, Proc. Roy. Soc. (London), Ser. A 274, 55 (1963).
W. N. Hansen, J. Electroanal. Chem. 150, 133 (1983).
D. C. Grahame, Chemistry 41, 441 (1947).
H. Wroblowa, Z. Kovac, and J. O.’M. Bockris, Trans. Faraday Soc. 61, 1523 (1965).
M. A. V. Devanathan and J. M. Fernando, Trans. Faraday Soc. 58, 368 (1962).
D. C. Grahame, J. Am. Chem. Soc. 76, 4819 (1954).
G. Valette, J. Electroanal. Chem. 122, 285 (1981).
J. G. Gordon II, O. R. Melroy, and L. Blum, in: Diffusion at Interfaces: Microscopic Concepts (M. Grunze, H. J. Kreuzer, and J. J. Weimer, eds.), Springer Ser. Surf Sci. 12, 172 (1988).
R. G. Sonnenfeld, J. Schneir, and P. K. Hansma, in: Modem Aspects of Electrochemistry, No. 21 (R. E. White, J. O.’M. Bockris, and B. E. Conway, eds.), pp. 1-28, Plenum Press, New York (1990).
J. P. Badiali, M. L. Rosenberg, F. Vericat, and L. Blum, J. Electroanal. Chem. 158, 253 (1983).
W. Schmickler and D. Henderson, J. Chem. Phys. 80, 3381 (1984); 85, 1650 (1986).
Z. Kovac and C. J. Sambucetti, in: Colloids and Surfaces in Reprographic Technology (M. Hair and M. D. Crouchep, eds.), ACS Symposium Series 200, p. 543, American Chemical Society, Washington, D.C. (1982).
M. Paunovic and I. Ohno (eds.), Proceedings of the Symposium on Electroless Deposition of Metals, Proceedings Vol. 88-12, The Electrochemical Society, Pennington, New Jersey (1988).
W. Goldie, Metallic Coating of Plastic, Vol. 1, Electrochemical Publications Ltd., Middlesex, England (1968).
R. Sarc, J. Electrochem. Soc. 117, 864 (1970).
M. Schlesinger and J. Kisel, in: Proceedings of the Symposium on Electroless Deposition of Metals (M. Paunovic and I. Ohno, eds.), p. 100, Proceedings Vol. 88-12, The Electrochemical Society, Pennington, New Jersey (1988).
R. L. Cohen, J. F. D’Amico, and K. W. West, J. Electrochem. Soc. 118, 2042 (1971).
R. L. Cohen and K. W. West, J. Electrochem. Soc. 119, 433 (1972).
C. R. Shipley, Jr., U.S. Patent 3,011,920 (1961).
J. Horkans, K. Jim, C. McGrath, and L. T. Romankiw, J. Electrochem. Soc. 134, 300 (1987).
R. J. Zeblisky, U.S. Patent 3,682,671 (1972).
J. Horkans and C. J. Sambucetti, IBM J. Res. Dev. 28, 690 (1984).
E. J. M. O’Sullivan, J. Horkans, J. R. White, and J. M. Roldan, IBM J. Res. Dev. 32, 591 (1988).
R. I. Jensen, J. P. Cummings, and H. Vora, Proceedings of 34th Electronic Components Conference, p. 73 Institute of Electrical and Electronics Engineers, New York (1984).
F. A. Lowenheim (ed.), Modern Electroplating, Chapter 19, McGraw-Hill, New York, (1978).
R. L. Cohen and K. W. West, J. Electrochem. Soc. 120, 502 (1973).
R. L. Cohen and R. L. Meeks, J. Colloid Interface Sci. 55, 156 (1976).
R. L. Cohen and K. W. West, Chem. Phys. Lett. 16, 128 (1972).
E. Matijevic, A. M. Poskanzer, and P. Zuman, Plating 62, 958 (1975).
R. L. Meek, J. Electrochem. Soc. 122, 1177 (1975).
U. Chaudhry, Du Pont Central Research Colloidal Laboratory, private communication (1985).
L. T. Romankiw, M. Slusarczuk, and D. Thompson, U.S. Patent 3,972,595 (1976).
G. J. Fan and R. A. Toupin, U.S. Patent 3,805,272 (1974); 3,916,419 (1975).
G. J. Fan, W. Hurley, D. C. W. Lo, and J. W. Mitchell, U.S. Patent 4,068,240 (1978).
R. E. Rosensweig, U.S. Patent 3,612,584 (1971); 3,620,630 (1971); 3,734,578 (1973).
S. S. Pappel, U.S. Patent 3,215,572 (1965).
R. Kaiser and G. Miskolczy, J. Appl. Phys. 41, 1064 (1970).
S. E. Khalafalla and G. W. Reimers, U.S. Patent 3,843,540 (1974).
Z. Kovac and B. A. Gardineer, U.S. Patent 3,990,981 (1976).
Z. Kovac and C. J. Sambucetti, U.S. Patent 4,107,063 (1978).
S. E. Khalafalla and G. W. Reimers, IEEE Trans. Magn. MAG-16, 178 (1980).
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© 1992 Plenum Press, New York
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Kovac, Z., Sambucetti, C.J. (1992). Importance of Electrical Double Layer in Technological Applications. In: Murphy, O.J., Srinivasan, S., Conway, B.E. (eds) Electrochemistry in Transition. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-9576-2_3
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DOI: https://doi.org/10.1007/978-1-4615-9576-2_3
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