Abstract
The popularity of mobile communications has created a large demand for both end user equipment and the integrated circuits inside them. While early cellular and cordless phones had relatively low complexity chips with discrete circuits implementing many functions, modern phones have highly integrated baseband sections and increasingly integrated radio sections. The next challenge for the industry is to successfully bring mobile communications to the consumer market. Semiconductor technology is a key enabler to meet that goal. The future of integrated circuits will include highly integrated radio solutions, including integration of key filters. Baseband sections will have communications-specific DSP solutions and highly integrated audio sections. These advances will enable very small handsets to be built at a lower cost than ever before.
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© 1997 Springer Science+Business Media New York
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Fague, D.E. (1997). Future Wireless Challenges for Integrated Circuits. In: Reed, J.H., Rappaport, T.S., Woerner, B.D. (eds) Wireless Personal Communications. The Springer International Series in Engineering and Computer Science, vol 377. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6237-5_20
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DOI: https://doi.org/10.1007/978-1-4615-6237-5_20
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