Abstract
The popularity of mobile communications has created a large demand for both end user equipment and the integrated circuits inside them. While early cellular and cordless phones had relatively low complexity chips with discrete circuits implementing many functions, modern phones have highly integrated baseband sections and increasingly integrated radio sections. The next challenge for the industry is to successfully bring mobile communications to the consumer market. Semiconductor technology is a key enabler to meet that goal. The future of integrated circuits will include highly integrated radio solutions, including integration of key filters. Baseband sections will have communications-specific DSP solutions and highly integrated audio sections. These advances will enable very small handsets to be built at a lower cost than ever before.
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References
I. Koullias, J. Havens, I. Post, and P. Bronner, “A 900 MHz Transceiver Chip Set for Dual-Mode Cellular Radio Mobile Terminals”, 1993 IEEE International Solid-Slate Circuits Conference, February 24–26, 1993, San Francisco, pp. 140–141.
B. Bjerde, J. Lipowski, J. Petranovich, and S. Gilbert, “An Intermediate Frequency Modulator Using Direct Digital Synthesis Techniques for Japanese Personal Handy Phone (PHP) and Digital European Cordless Telecommunications (DECT)”, Proceedings of the 44th IEEE Vehicular Technology Conference, Stockholm, Sweden, June 8-10, 1994, pp. 467–471.
B. Wuppermann, S. Atkinson, B. Fox, B. Jansen, and G. Jusuf, “A 2.7 V Two Chip Set Transceiver for DECT”, Proceedings of the Fourth International Symposium on Personal, Indoor, and Mobile Radio Communications, Yokohama, Japan, September 8-11, 1993, pp. 407–411.
K. Hess and D. Fague, “Performance Evaluation of a Single Chip Radio Transceiver”, Proceedings of the 46th IEEE Vehicular Technology Conference, Atlanta, Georgia, April 28-May 1, 1996, pp. 1048–1051.
C. Takahashi, et. al., “A 1.9 GHz SI Direct Conversion Receiver IC for QPSK Modulation Systems”, Proceedings of the 1995 IEEE ISSCC, Feb. 1995, San Francisco, CA, pp. 138–139, 352.
W. Kuhn, F. Stephenson, and A. Elshabinl-Riad, “A 200 MHz CMOS Q-Enhanced LC Bandpass Filter”, submitted to IEEE Journal of Solid State Circuits for publication.
C. T.-C. Nguyen and R.T. Howe, “CMOS Micromechanical Resonator Oscillator”, Technical Digest, IEEE International Electron Devices Meeting, Washington, D.C., December 5-8, 1993, pp. 199-202.
C. T.-C. Nguyen, “Micromechanical Resonators for Oscillators and Filters”, Proceedings of the 1995 IEEE International Ultrasonics Symposium, Seattle, WA, November7-10, 1995.
B. Brannon, “Using Wide Dynamic Range Converters for Wide Band Radios”, RF Design, vol. 18, no. 5, May 1995, pp. 50–55, 63-65.
R. Baines, “The DSP Bottleneck”, IEEE Communications Magazine, vol. 33, no.5, May 1995, pp. 46–54.
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© 1997 Springer Science+Business Media New York
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Fague, D.E. (1997). Future Wireless Challenges for Integrated Circuits. In: Reed, J.H., Rappaport, T.S., Woerner, B.D. (eds) Wireless Personal Communications. The Springer International Series in Engineering and Computer Science, vol 377. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6237-5_20
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DOI: https://doi.org/10.1007/978-1-4615-6237-5_20
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