Abstract
In the competitive electronics market of today, yield at each manufacturing step is a key measure of success. It defines cost and is often an indicator of device quality and reliability. With the unrelenting march towards miniaturization in device designs and concomitant packaging technologies, the process-control requirements are becoming more stringent and the attainment of higher yield requires a process engineer to control variability at each of the many processing steps in the microelectronic manufacturing processes. All the variables controlling the desired output in a given process need to be understood and optimized for tighter control. In addition, the process controller must be quick and responsive to the variations in the input parameters.
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Mahajan, R.L. (1998). Process modeling, optimization and control in electronics manufacturing. In: Manufacturing Challenges in Electronic Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5803-3_5
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DOI: https://doi.org/10.1007/978-1-4615-5803-3_5
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