Abstract
Solid bodies only join if their surfaces are brought into contact and a bond is formed. The phenomenon itself seems quite natural and simple. However, various bonding methods exist today, indicating that the joining phenomenon is far from simple.
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References
L.E. Murr, Interface Phenomena in Metals and Alloys, Addison-Wesley Pub. Co. (1975).
R.J. Good, L.A. Girifalco, G. Kraus, J. Phys. Chem. 62:1418 (1958).
R.M. Pillar, J. Nutting, Phil. Mag., 16:181 (1967).
T. Suga, Y. Takahashi, H. Takagi, Ceramic Transactions, 35:323 (1993).
T. Suga, K. Miyazawa, Acta Scripta Metall, Proc. Ser. 4:189 (1990).
T. Suga, Y. Takahashi, H. Takagi, et al, Acta Metall Mater., 40:s133 (1992).
T. Suga, Proc. 2nd Int. Symp. on Semiconductor Wafer Bonding, Hawaii, 314 (1993).
T. Nishikawa, et al., Ann. Mtg. Japan Welding Soc., 53:198 (1993).
R. Kajiwara, et al., Ann. Mtg. Japan Welding Soc., 55:110 (1994).
O. Ohashi, Ann. Mtg. Japan Inst. Mater., 169 (1993).
K. Saijoh. Ann. Mtg. Japan Inst. Mater., 462 (1990).
H. Takagi, K. Kikuchi, R. Maeda, T.R. Chung, T. Suga, Phys. Lett., 68:2222 (1996).
T. Suga, N. Hosoda, Proc. MEMS’95 (1995).
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© 1998 Springer Science+Business Media New York
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Suga, T. (1998). Recent Progress in Surface Activated Bonding. In: Tomsia, A.P., Glaeser, A.M. (eds) Ceramic Microstructures. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5393-9_36
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DOI: https://doi.org/10.1007/978-1-4615-5393-9_36
Publisher Name: Springer, Boston, MA
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