Abstract
High quality diamond films have potential applications in high speed, high temperature electronic devices and hard, wear resistant coatings for cutting tools. Diamond is an ideal material for substrates or thin films in integrated circuits because it has the combined properties of high thermal conductivity, high electrical resistivity, and low dielectric constant.1,5 In addition to passive roles as heat sinks, diamond is also being evaluated as a device material for microwave frequency and semiconductor applications. Diamond is desirable for electronics operating at microwave frequencies because of its low susceptibility to X-ray, ultraviolet, and gamma radiation damage.3,5 The interest in diamond as a semiconductor stems from its ability to operate at temperatures between 100°C and 500°C, beyond the range of most smaller band gap semiconductors.6
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Carasso, M.L., Staehle, S.S., Demkowicz, P.A., Gilbert, D.R., Singh, R.K., Adair, J.H. (1998). Control of the Microstructure of Polycrystalline Diamond And Related Materials Via an Enhanced Cvd Process. In: Tomsia, A.P., Glaeser, A.M. (eds) Ceramic Microstructures. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5393-9_19
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