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Microelectronics Packaging—An Overview

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Microelectronics Packaging Handbook

Abstract

Packaged electronics is the embodiment of all electronic equipment—calculators, personal computers (PCs), mainframe computers, telephones, television, and so forth. It consists of the active components, such as integrated circuit (IC) chips, flat-panel and cathode-ray-tube displays, loudspeakers, and so on. The active components are interconnected, supplied with electric power and housed in packaging. Success in a very competitive marketplace hinges on superior performance and price.

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Author information

Authors and Affiliations

  1. Rensselaer, USA

    Eugene J. Rymaszewski

  2. Georgia Tech, USA

    Rao R. Tummala

  3. NEC, Japan

    Toshihiko Watari

Authors
  1. Eugene J. Rymaszewski
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  2. Rao R. Tummala
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  3. Toshihiko Watari
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Editor information

Editors and Affiliations

  1. Georgia Institute of Technology, USA

    Rao R. Tummala

  2. Rensselaer Polytechnic Institute, USA

    Eugene J. Rymaszewski

  3. AGK Enterprises, USA

    Alan G. Klopfenstein

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© 1997 Springer Science+Business Media Dordrecht

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Rymaszewski, E.J., Tummala, R.R., Watari, T. (1997). Microelectronics Packaging—An Overview. In: Tummala, R.R., Rymaszewski, E.J., Klopfenstein, A.G. (eds) Microelectronics Packaging Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-4086-1_1

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  • DOI: https://doi.org/10.1007/978-1-4615-4086-1_1

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-6829-8

  • Online ISBN: 978-1-4615-4086-1

  • eBook Packages: Springer Book Archive

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