Abstract
In the reflow soldering of surface mount assemblies. solder paste is used for the connection between the leads or terminations of surface mount components and the lands. Solder paste is applied to the surface mount lands by screening, stenciling, or dispensing. Each process has its pros and cons.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
J-STD-005. Requirements for soldering pastes. Available from IPC, Northbrook, IL.
Stein, A.M. “How to choose solder paste for surface mounting. Part 1.”ElectronicsJune 1985, pp. 57–59.
Rooz-Kozel, B. Solder Paste, Surface Mount Technology. International Society for Hybrid Microelectronics Technical Monograph Series 6984–002, Reston, VA, 1984.
Peterson, G.G. “A practical guide for specifying printing equipment for electronic applications. SMT-III-21Proceedings of the SMART III Conference(IPC/EIA), January 1987.
Jennie S. Hwang. “Solder/Screen Printing.”Surface Mount TechnologyMarch 1994, pp. 44–50.
J-STD-004. Requirements for soldering fluxes. Available from IPC, Northbrook, IL.
Seelig, Karl, “A new generation of no clean solder paste,”Proceedings of Surface Mount InternationalAugust 30-Sept. 3, 1992, pp. 705–715.
O’Hara, Wanda B., and Lee, Ning-Chen. “How voids develop in BGA joints.”Surface Mount TechnologyJanuary 1996, pp. 4447.
Rosen, R.L.Fundamental Properties of Polymeric Materials.New York: Wiley, 1982, p. 202.
MacKay, C.A. “Solder creams and how to use them.”Electronic Packaging and ProductionFebruary 1981, TR-1071.
Kevra, Joseph. “Solder paste rheology using spiral viscometer.”Proceedings of ISHM1991, pp. 240–243.
Morris, J. “Solder paste tackiness measurement.”IPC Technical ReviewSeptember-October 1987, pp. 18–24.
Mackay, C.A. “What you don’t know about solder creams.”Circuits ManufacturingMay 1987, pp. 43–52.
Heimsch, R.D. “Framework for the evaluation of precision screen printing equipment.”Hybrid Circuit TechnologyJune 1986, pp. 19–24.
Atkinson, R.W. “An automated screen printer.”Circuits ManufacturingJanuary 1983, pp. 26–29.
Borneman, J.D., and Rennaker, R.L. “Paste printing from a pro.”Circuits ManufacturingFebruary 1987, p. 38.
Bennett, Rickey. “Controlling paste volume with vector printing.”Surface Mount TechnologyJune 1995, pp 96.
Herbst, Mark D. “Metal mask stencils: The key components.”Surface Mount TechnologyOctober 1992, pp. 20–22.
Coleman, William E., “Photochemically etched stencils for ultra-fine pitch printing.”Surface Mount TechnologyJune 1993, pp. 18–24.
Clouthier, Richard. “Appraising stencils for fine-pitch printing.”Surface Mount TechnologyMarch 1995, pp. 60–64.
Dody, Glen, and Burnette, Terry. “BGA assembly process and rework.”Proceedings of Surface Mount InternationalAugust 29–31, 1995, pp. 361–366.
Belmonte, Joe and Zarrow, Phil. “Advanced surface mount manufacturing methods,”Circuits AssemblySeptember 1996, pp. 3641.
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1997 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Prasad, R.P. (1997). Solder Paste and Its Application. In: Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-4084-7_9
Download citation
DOI: https://doi.org/10.1007/978-1-4615-4084-7_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-412-12921-6
Online ISBN: 978-1-4615-4084-7
eBook Packages: Springer Book Archive