Abstract
The reliability of solder joints often depends directly on the mechanical properties of the solder alloy. The tensile strength of the alloy determines the resistance of the joint to mechanical rupture under short-term direct loading, as might occur during impact testing. If the solder joint is subjected to cyclic stresses and strains generated by thermal expansions during thermal cycling, the reliability depends on resistance to fatigue. Because the temperatures of application of solder joints are typically a substantial fraction of the melting temperature of the alloy, the low frequency fatigue behavior is related to stress relaxation and creep behavior.
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References
Wilcox, J. R., R. Subrahmanyan, and Che-Yu Li, “Thermal Stress Cycles and Inelastic Deformation in Solder Alloys,” Proceedings of 1989 ASM Electronic Packaging Conference—Materials and Processes. ASM International, 24–28 April 1989, Philadelphia, PA., pp. 203–211.
Subrahmanyan, R., J. R. Wilcox, and Che-Yu Li. “A Damage Integral Approach to Solder Joint Fatigue,” Proceedings of 1989 ASM Electronic Packaging Conference—Materials and Processes. ASM International, 24–28 April 1989, Philadelphia, PA, pp. 213–221; also “A Damage Integral Approach to Thermal Fatigue of Solder Joints.” Proceedings of 39th Electronics Components Conference, IEEE, 22–24 May 1989, Houston, TX.
Karakaya, I., and W.T. Thompson, “The Pb-Sn (Lead-Tin) System,” Bulletin of Alloy Phase Diagrams, 9(2), 1988, pp. 144–152.
Karakaya, I., and W.T. Thompson, “Morphology and Kinetics of Cellular Dissolution of the Pb-Sn Alloy,” Metallurgical Transactions, 2, 1971, pp. 2509–2515.
Turnbull, D., and H.N. Treaftis, “Kinetics of Precipitation of Tin from Lead-Tin Solid Solutions,” Acta Metallurgica, 3, 1955, pp. 43–54.
Turnbull, D., and H.N. Treaftis, “Micrographic Investigation of Precipitation in Pb-Sn Alloys,” Trans AIME 212 1958, pp. 33–42.
Tu, K.N., and D. Turnbull, “Morphology of Cellular Precipitation of Tin from Lead-Tin Bicrystals,” Acta Metallurgica, 15 1967, pp. 369–376.
Tu, K.N., and D. Turnbull, “Morphology of Cellular Precipitation of Tin from Lead-Tin Bicrystals-H,” Acta Metallurgica, 15 1967, pp. 1317–1323.
Tu, K.N., and D. Turnbull, “Morphology and Structure of Tin Lamellae Formed by Cellular Precipi-tation,” Acta Metallurgica, 17 1969, pp. 1263–1279.
Afanas’yev, N.I., and T.F. Yelsukova, “Ageing Peculiarities of Lead-Tin Alloys and Experimental Testing of Continuous Decomposition Theories,” Phys. Met. Metall., 53 1982, pp. 129–134.
Afanas’yev, N.I., and T.F. Yelsukova, “The Influence of Impurities on the Rate of Discontinuous Decomposition of Lead-Tin Alloys,” Phys. Met. Metall., 57 1984, pp. 86–91.
Varkey, P.A., and A.R.K.L. Padmini, “Precipitation Studies in Lead-Tin Alloys,” Acustica 52 1983, pp. 290–295.
Osorio, F.S. “Morphology of the Cellular Precipitation Reaction in a Pb-3.0 wt% Sn Alloy,” Thesis, University of Missouri-Rolla, 1973.
Hackney, S.A., and F.S. Biancaniello, “Experimental Indications of a Low Undercooling Instability in the Cellular Mechanism of Discontinuous Precipitation,” Scripta Metallurgica, 21 1987, pp. 371–376.
Lutender, S.D., “Micrographic Study of the Precipitation and Dissolution Kinetics of Selected Pb-Sn Alloys,” M.E. Thesis, Dartmouth College, 1986.
Borelius, G., F. Larris, and E. Ohlsson, “Kinetics of Precipitation in Pb-Sn Alloys,” Arkiv För Matematik, Astronomi och Fysik, 31A(10) 1944, pp. 1–19.
Frear, D.R., J.B. Posthill, and J.W. Morris, Jr., “The Microstructural Details of f3-Sn Precipitation in a 5Sn-95Pb Solder Alloy,” Metallurical Transactions, 20A 1989, pp. 1325–1333.
Frost, H.J., R.T. Howard, P.R. Lavery, and S.D. Lutender, “Creep and Tensile Behavior of Lead-Rich Lead-Tin Alloys,” IEEE Trans. on Components, Hybrids and Manufact. Tech., 11, 1988, pp. 371–379.
Frost, H.J., R.T. Howard, and G.J. Stone, “The Effects of Thermal History on the Microstructure and Mechanical Properties of Solder Alloys,” Microelectronic Packaging Technology, Materials and Processes. W. T. Shieh, Ed. ASM Internation, 1989, pp. 121–127.
Frost, H.J., P.R. Lavery, and S.D. Lutender, “Microstructure and Mechanical Properties of Lead-Tin Alloys,” in Electronic Packaging and Corrosion in Microelectronics, M.E. Nicholson, Ed. ASM International, 1987, pp. 259–267.
Livingston, J.D., and J.W. Calm, “Discontinuous Coarsening of Aligned Eutectoids,” Acta Metallurgica 22, 1974, pp. 495–503.
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Frost, H.J. (1991). Microstructure and Mechanical Properties of Solder Alloys. In: Lau, J.H. (eds) Solder Joint Reliability. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3910-0_8
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DOI: https://doi.org/10.1007/978-1-4615-3910-0_8
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