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Solder Attachment Reliability, Accelerated Testing, and Result Evaluation

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Book cover Solder Joint Reliability

Abstract

The reliability of electronic assemblies depends on the reliability of their individual elements—e.g., integrated circuit (ICs); active components: chip carriers (CCs), small-outline integrated circuits (SOICs), small-outline transistors (SOTs), dual in-line packages (DIPs), small-outline J-leaded devices (SOJs), etc.); passive components (chip resistors, chip capacitors); printed wiring boards (PWBs); connectors; etc.—and the reliability of the mechanical, thermal, and electrical interfaces (or attachments) between these elements. These interfaces can be connector contacts, wire-wraps, thermal shunts, bonding layers between a printed circuit board and a heat sink, leads soldered into plated through holes (PTHs), chip solder attachments (flip-chip or C4), or surface mount (SM) solder joints.

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Authors
  1. Werner Engelmaier
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John H. Lau

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© 1991 Springer Science+Business Media New York

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Engelmaier, W. (1991). Solder Attachment Reliability, Accelerated Testing, and Result Evaluation. In: Lau, J.H. (eds) Solder Joint Reliability. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3910-0_17

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  • DOI: https://doi.org/10.1007/978-1-4615-3910-0_17

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-6743-7

  • Online ISBN: 978-1-4615-3910-0

  • eBook Packages: Springer Book Archive

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