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Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints

  • Chapter
Solder Joint Reliability

Abstract

Surface mount technology (SMT) is currently one of the strongest trends in electronic packaging and interconnect assembly. This technology offers oppor-tunities for significant cost reduction and for efficient production line automation.

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Lau, J.H. (1991). Static and Dynamic Analyses of Surface Mount Component Leads and Solder Joints. In: Lau, J.H. (eds) Solder Joint Reliability. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3910-0_15

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