Abstract
Sulfur hexafluoride (SF6), either pure or mixed with other gases, is commonly used as an insulator in high voltage-equipment. Consequently, many studies have been performed to investigate the decomposition of SF6 in various electrical discharges including corona,1 sparks,2 and arcs.3 These studies have shown that large quantities of toxic and corrosive by-products such as SO2, SOF2, SO2F2, SOF4, SF4, and S2F10 are produced when SF6 is dissociated in the discharge. Additionally, recent studies of SF6 as an etching gas for semiconductor processing have indicated that stable sulfur oxyfluoride by-products can account for more than 10% of the neutral molecules in the plasma.4
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Olthoff, J.K., Van Brunt, R.J., Wan, HX., Moore, J.H., Tossell, J.A. (1991). Total Cross Sections for Electron Scattering and Attachment for SF6 and Its Electrical-Discharge by-Products. In: Christophorou, L.G., Sauers, I. (eds) Gaseous Dielectrics VI. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3706-9_3
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DOI: https://doi.org/10.1007/978-1-4615-3706-9_3
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