Abstract
The use of faster logic switching speeds and higher levels of integrated circuit functional integration are placing new demands on digital system interconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end product development, fabrication, assembly, testing and maintenance purposes. [1]
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© 1992 Springer Science+Business Media New York
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Ginsberg, G.L. (1992). Subassembly Interconnection Systems. In: Electronic Equipment Packaging Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3542-3_6
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DOI: https://doi.org/10.1007/978-1-4615-3542-3_6
Publisher Name: Springer, Boston, MA
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