Abstract
Until recently, packaged component subassembly technologies were based on the use of printed wiring boards and through-hole mounted components. However, during the last several years there has been considerable activity in developing new integrated-circuit device packages and improving the density and performance of the enhanced printed wiring boards (i.e., packaging and interconnecting structures) that mount and interconnect them.
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References
Christopher Van Veen, Teradyne Connection Systems, “Design Considerations for Backplane Interconnection Systems,” Electri-Onics, February 1986, pp. 77–80.
C. Michael Hayward, Hybricon Corp., “Backplane Design Considerations,” Connection Technology, October 1986, pp. 35–40.
“Component Packaging and Interconnecting with Emphasis on Surface Mounting,” ANSI/IPC-780, July 1988, Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL 60646.
“Flexible Printed Wiring,” Printed Wiring Design GuideIPC-D-330, Section 6, Institute for Interconnecting and Packaging Electronic Circuits (IPC), Lincolnwood, IL 60646.
“Printed Board Component Mounting,” ANSI/IPC-CM-770, Revision C, February 1987, Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL 60646.
“Surface Mount Land Patterns (Configurations and Design Rules),” March 1987, Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL 60646.
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© 1992 Springer Science+Business Media New York
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Ginsberg, G.L. (1992). Packaged Component Subassemblies. In: Electronic Equipment Packaging Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3542-3_5
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DOI: https://doi.org/10.1007/978-1-4615-3542-3_5
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-23818-6
Online ISBN: 978-1-4615-3542-3
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