Abstract
The inspection, rework, and repair of improperly assembled or electrically defective FPT packages is difficult. The high lead counts and fine lead pitches make visual inspection a challenge. The common method of desoldering a fine pitch part is to use hot air or a hot bar to remelt the solder so the package can be removed or repositioned on the board. Remelting the solder uniformily is tough and may introduce the problem of lifted lands or bent leads.
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References
Marcoux, P. 1991. Operator SMT Inspection, Rework and Repair Techniques. Sunny-vale, CA: PPM Associates and Dearborn, MI: Society of Manufacturing Engineers.
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© 1992 Springer Science+Business Media New York
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Marcoux, P.P. (1992). Inspection, Rework, and Repair. In: Fine Pitch Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3532-4_9
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DOI: https://doi.org/10.1007/978-1-4615-3532-4_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-00862-8
Online ISBN: 978-1-4615-3532-4
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