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Post Reflow Cleaning

  • Phil P. Marcoux
Chapter
  • 79 Downloads

Abstract

Cleaning electronic assemblies has caused heated debates for the past several years. Cleaning is done primarily for cosmetic and reliability reasons. Suppliers want products to look good. Customers want highly reliable products. A clean assembly implies, in many minds, a high reliability assembly.

Keywords

Test Pattern Solder Ball Test Fixture Electronic Assembly Stainless Steel Probe 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Denyon, W., and Wargotz, W., and Turbini, L. 1990. Guidelines for Cleaning of Printed Boards and Assemblies, IPC-CH-65. Lincolnwood, IL: IPC.Google Scholar
  2. 2.
    Marcoux, P. 1992. PCA Design Guidelines Manual. Sunnyvale, CA: PPM Associates.Google Scholar
  3. 3.
    Morris, J. and Conway, J. No-Clean Reflow Process Implementation. In Circuits Assembly,Aug., 1991.Google Scholar
  4. 4.
    — 1991. Cleaning and Cleanliness Test Program, IPC-TR-580. Lincolnwood, IL: IPC.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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