Post Reflow Cleaning

  • Phil P. Marcoux


Cleaning electronic assemblies has caused heated debates for the past several years. Cleaning is done primarily for cosmetic and reliability reasons. Suppliers want products to look good. Customers want highly reliable products. A clean assembly implies, in many minds, a high reliability assembly.


Test Pattern Solder Ball Test Fixture Electronic Assembly Stainless Steel Probe 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    Denyon, W., and Wargotz, W., and Turbini, L. 1990. Guidelines for Cleaning of Printed Boards and Assemblies, IPC-CH-65. Lincolnwood, IL: IPC.Google Scholar
  2. 2.
    Marcoux, P. 1992. PCA Design Guidelines Manual. Sunnyvale, CA: PPM Associates.Google Scholar
  3. 3.
    Morris, J. and Conway, J. No-Clean Reflow Process Implementation. In Circuits Assembly,Aug., 1991.Google Scholar
  4. 4.
    — 1991. Cleaning and Cleanliness Test Program, IPC-TR-580. Lincolnwood, IL: IPC.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

Personalised recommendations