Abstract
Solder reflow is the term used to describe the process of heating the assembly until the solder paste melts and wets, forming a solder joint with the copper land and the package lead.
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© 1992 Springer Science+Business Media New York
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Marcoux, P.P. (1992). Solder Reflow. In: Fine Pitch Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3532-4_7
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DOI: https://doi.org/10.1007/978-1-4615-3532-4_7
Publisher Name: Springer, Boston, MA
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