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Solder Reflow

  • Phil P. Marcoux
Chapter
  • 82 Downloads

Abstract

Solder reflow is the term used to describe the process of heating the assembly until the solder paste melts and wets, forming a solder joint with the copper land and the package lead.

Keywords

Heat Transfer Solder Joint Heat Transfer Rate Convection Heating Fine Pitch 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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