Abstract
Solder is a soft metal alloy that bonds to metal surfaces to form a joint. Solder has been used in electronic products used for decades to provide a reliable mechanical joint and an excellent electrical conductor. Tin-lead alloy solder has been the standard. However, double sided SMT assembly, environmental concerns with lead, and the demands of fine pitch technology are causing some users to explore alternatives.
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© 1992 Springer Science+Business Media New York
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Marcoux, P.P. (1992). Solder and Application Methods. In: Fine Pitch Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3532-4_5
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DOI: https://doi.org/10.1007/978-1-4615-3532-4_5
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-00862-8
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