Abstract
Fine pitch packages will, in time, be used in all applications incorporating electronics. Today, FPT is associated closely with application specific ICs, high lead count microprocessors and math coprocessors, and high density memory applications. Who begat whom—in this case, does FPT allow more justification for ASICs and memory, or vice versa—is fodder for some lengthy debates, but not in this text.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Aburaya, K. 1989. Examples of the Latest SMT Installation Techniques in Audio and Video Equipment. Proceedings of ISHM “89, Oct. 1989, Baltimore, MD.
Marcoux, P. 1989. Fine Pitch Technology—A Market Study. Saratoga, CA: Electronic Trend Publications.
Vardaman, E. J. 1990. New TAB Developments in the United States and Japan: A Market/Technology Comparison. In Semiconductor World. June, 1989.
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1992 Springer Science+Business Media New York
About this chapter
Cite this chapter
Marcoux, P.P. (1992). Fine Pitch Product Applications. In: Fine Pitch Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3532-4_3
Download citation
DOI: https://doi.org/10.1007/978-1-4615-3532-4_3
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-00862-8
Online ISBN: 978-1-4615-3532-4
eBook Packages: Springer Book Archive