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Specific Design Guidelines for FPT Packages

  • Phil P. Marcoux
Chapter
  • 81 Downloads

Abstract

This section contains design guidelines to satisfy the various “abilities” that a product must meet. The guidelines are derived from the author’s and other’s experiences of the past several years involvement with fine pitch and surface mount technology. The abilities that are incorporated in this section are:
  • Designability

  • Manufacturability

  • Repairability

  • Reliability

  • Testability

  • Marketability

Keywords

Solder Joint Bare Copper Fine Pitch Placement Machine Package Lead 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    Leppo, M. et. al. 1989. Substrates and Packages. Electronics Materials Handbook, Vol. 1. Materials. Park, OH: ASM International.Google Scholar
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    Marcoux, P., et al., 1989. An Introduction to TAB and Fine Pitch Technology SMC-TR001. Lincolnwood, IL: Surface Mount Council.Google Scholar
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    — 1991. Testability Guidelines, TP-101A. Edina, MN: Surface Mount Technology Association.Google Scholar
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    — 1992. Electronic Design Data Exchange Guidelines, IPC-D-395 (formerly the IPCD-350). Lincolnwood, IL: IPC.Google Scholar
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    — 1992. Surface Mount Configurations and Land Patterns, IPC-SM-782A. Lincolnwood, IL: IPC.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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