Design for Manufacturability

  • Phil P. Marcoux


This chapter moves from the specifics of fine pitch technology to temporarily cover a more general topic which affects all electronic assemblies regardless of the manufacturing technology used in assembly.


Design Guideline Fiducial Mark Process Capability Index Pareto Chart Design Review 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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    Bancroft, C.E. 1989. Design for Assembly and Manufacture. Electronic Materials Handbook, Vol. 1. Materials, Park, OH: ASM International.Google Scholar
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    Marcoux, P. 1991. Design for Electronic Printed Wire Assemblies. Manufacturing Engineers Handbook, Vol. 6. Dearborn, MI: Society of Manufacturing Engineers.Google Scholar
  3. 3.
    Marcoux, P. 1992. PCA Design Guidelines Manual. Sunnyvale, CA: PPM Associates.Google Scholar
  4. 4.
    Parden, R. 1990. Private correspondence.Google Scholar
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    Spitz, L. 1990. Design for Manufacturability. In Electronic Packaging and Production, Nov., 1990.Google Scholar
  6. 6.
    Stout, G. 1990. Private correspondence.Google Scholar
  7. 7.
    Wojslaw, C. 1990. Private correspondence.Google Scholar
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    — 1991. Time-To-Market. In Evaluation Engineering, May, 1991.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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