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Design for Reliability Guidelines

  • Phil P. Marcoux
Chapter
  • 79 Downloads

Abstract

Solder joint reliability is a significant issue as the solder joint area becomes smaller. Achieving reliability over the expected service life in a product using fine pitch packages must be addressed at the design level. After all, the surface mounted fine pitch leads are the only means of mechanical support and electrical connection to the package.

Keywords

Solder Joint Fatigue Damage Fine Pitch Solder Joint Reliability Fatigue Hysteresis 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    Balde, J. W. 1987. The IEEE Compliant Lead Task Force. IEEE Transactions CHMT-10 (3) pp. 463–469.Google Scholar
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    Engelmaier, W. 1991. Designing for SMT Solder Joint Reliability. Dearborn, MI: Society of Manufacturing Engineers.Google Scholar
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    Engelmaier, W. 1991. Private correspondence.Google Scholar
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    Evans, J. and Engelmaier, W. 1990. SMT Reliability for Space Flight Applications. In Surface Mount Technology, Nov., 1990.Google Scholar
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    Mandel, C. E. N. 1989. Environmental Stress Screening. In Electronic Materials Handbook, Vol. I. Materials. Park, OH: ASM Intrnational.Google Scholar
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    Marcoux, P. 1987. Implementation and Control Techniques for SMT. San Jose, CA: International Quality Technologies.Google Scholar
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    Marcoux, P. et. al 1991. Status of the Technology and Action Plan. Lincolnwood, IL: Surface Mount Council.Google Scholar
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    McShane, M. et. al. 1990. Lead Configuration and Performance for Fine Pitch SMT Reliability. Proceedings of Nepcon West ‘80, Feb. 1990, Anaheim, CA.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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