Design for Reliability Guidelines

  • Phil P. Marcoux


Solder joint reliability is a significant issue as the solder joint area becomes smaller. Achieving reliability over the expected service life in a product using fine pitch packages must be addressed at the design level. After all, the surface mounted fine pitch leads are the only means of mechanical support and electrical connection to the package.


Solder Joint Fatigue Damage Fine Pitch Solder Joint Reliability Fatigue Hysteresis 
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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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