Introduction to Fine Pitch Technology (FPT)

Abstract

The family of fine pitch packages and the accompanying assembly technology evolved to satisfy the ongoing trends and demands of the consumers of electronic products. These trends and demands can be summarized as follows:

• 1 As silicon complexity grows, the number of leads required for input and output grow (Rent’s Rule).

• 2 The operating speeds and frequencies are increasing with functional capability, thus limiting the allowable parasitics in a package.

• 3 Consumers want more functions in the same or smaller size as a product’s predecessor.