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Introduction to Fine Pitch Technology (FPT)

  • Phil P. Marcoux
Chapter
  • 118 Downloads

Abstract

The family of fine pitch packages and the accompanying assembly technology evolved to satisfy the ongoing trends and demands of the consumers of electronic products. These trends and demands can be summarized as follows:
  1. 1

    As silicon complexity grows, the number of leads required for input and output grow (Rent’s Rule).

     
  2. 2

    The operating speeds and frequencies are increasing with functional capability, thus limiting the allowable parasitics in a package.

     
  3. 3

    Consumers want more functions in the same or smaller size as a product’s predecessor.

     

Keywords

Solder Joint Print Circuit Board Fine Pitch Assembly Technology Print Circuit Board Assembly 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Ginsberg, G. 1990. The Impact of New Technology on PCB Processing. In Electronic Packaging and Production. August, 1990.Google Scholar
  2. 2.
    Marcoux, P. 1990 Fine Pitch Technology—A Market Study Saratoga, CA: Electronic Trend Publications.Google Scholar
  3. 3.
    Marcoux, P. 1989. SMT: Design for Manufacturability. Sunnyvale, CA: PPM Associates and Dearborn, MI: Society of Manufacturing Engineers.Google Scholar
  4. 4.
    Messner, G. 1987. Cost-Density Analysis of Interconnections. IEEE Transactions on Components, Hybrids, and Manufacturing Technology CHMT-10(2): 143–151.CrossRefGoogle Scholar
  5. 5.
    Turmmala, R., and Tymaszewski, E. 1989. Microelectronics Packaging Handbook. New York: Van Nostrand Reinhold.Google Scholar
  6. 6.
    Initiates for High Value Electronics Packaging/Interconnect Program. 1991 Membership Workshop, Sept. 1991, MCC, Austin, TX.Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • Phil P. Marcoux
    • 1
  1. 1.PPM Associates, Inc.SunnyvaleUSA

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