Abstract
The thermal stability of polymers is influenced by both chemical and physical factors.1,2 The chemical factors are primary bond strength, secondary or van der Waals’ bonding forces, hydrogen bonding, resonance stabilization, mechanism of bond cleavage, molecular symmetry, purity, crosslinking and branching. The physical factors include molecular weight, molecular weight distribution and crystallinity. The primary bond strength contributes the most to the thermal stability of polymers. The bond dissociation energy4 of a carbon - carbon single bond is 350 kJ/mol, and that of a carbon -carbon double bond is 610 kJ/mol. A double bond in an aromatic system is further strengthened by resonance stabilization, adding 164 to 287 kJ/mol to the bond dissociation energy. Almost all thermally stable polymers contains aromatic carbocyclic or heterocyclic rings. The bond dissociation energy of a carbon - fluorine bond of 430 kJ/mol is increased to 504 kJ/mol by a second fluorine atom attached to the same carbon atom. Therefore, perfluorinated materials are more thermally stable. Inorganic polymers which have inherent higher bond strengths (e.g. B-N, Si-N, Ti-O) are often susceptible to chemical attack such as hydrolysis. As a consequence, few useful polymers containing inorganic backbones have been developed.5
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Cassidy, P. E. Thermally Stable Polymers: Marcel Dekker: New York, 1980.
Hergenrother, P. M. In Encyclopedia of Polymer Science and Technology. 2nd ed.; Mark, H. F.; Bikales, N. M.; Overberger, C. G.; Menges, G.; Kroschwitz, J.I., Eds.; Wiley-lnterscience: New York, 1987; Vol. 7, p 639.
Wendlandt, W. W.; Gallagher, P. K. In Thermal Characterization of Polymeric Materials Turi, E. A., Ed.; Academic Press: New York, 1981; p 1.
Cottrell, T. L. The Strength of Chemical Bonds. 2nd ed.; Butterworths: London, 1958.
Critchley, J. P.; Knight, G. J.; Wright, W. W. Heat Resistant Polymers: Plenum Press: New york, 1983.
Speight, J. G.; Kovacic, P.; Koch, F. W. J. Macromol. Sci., Rev. Macromol. Chem. 1971, 5, 295.
Preston, J. G. In Encyclopedia of Polymer Science and Technology. 2nd ed.; Mark, H. F.; Bikales, N. M.; Overberger, C. G.; Menges, G.; Kroschwitz, J. I., Eds.; Wiley-lnterscience: New York, 1988; Vol. 1, p 381.
St. Clair, A. K.; St. Clair, T. L Polym. Eng. Sci. 1982, 22, 9.
Sroog., C. E. J. Polym. Sci. Macromol. Rev. 1976. 11. 161.
Harvey, J. A. In Proceedings of the 3rd International SAMPE Electronic Materials and Process Conferences: Los Angeles, CA, 1989; p 124.
(a) Burggraaf, P. Semicond. Int. 1988, 11 (3), 58. (b) Senturia, D. S. In Polymers for High Technology: Bowden, M. J.; Turner, S. R., Eds.; ACS Symposium Series 346; American Chemical Society: Washington, DC, 1987; p 428. (c) Wong, C. P. Adv. Polvm. Sci. 1988. 84, 63. (d) Lee, Y. K.; Craig, J. D. In Polymers for Electronic Applications: Feit, E. D.; Wilkins, C. W., Eds.; ACS Symposium Series 184; American Chemical Society: Washington, DC, 1982; p 108. (e) Adduci, J. M. In Polyimides: Mittal, K. L., Ed.; Plenum Press: New York, 1984; p 1023. (f) Lacombe, R. H.; Greenblatt, J. Ibid, p 647.
Sato, K.; Harada, S.; Saiki, A.; Kimura, T.; Okubo, T.; Mukai, K. IEEE Trans. Parts. Hybrids and Packaging 1973, Vol PHP-9, 176.
(a) Wilson, A. N. Thin Solid Film 1981. 83, 145. (b) Economy, J. In Contemporary Topics in Polymer Science: Vandenberg, E. J., Ed.; Plenum Press: New York, 1984; p 351. (c) Rohde, O.; Riedieker, M.; Schaffner, A.; Bateman, J. Solid State Technol 1986, 29 (9), 109. (d) Jensen, J. In Polymers for High Technology: Bowden, M. J.; Turner, S. Ft., Eds.; CS Symposium Series 346; American Chemical Society: Washington, DC, 1987; p 466. (e) Saiki, A.; Mukai, K.; Harada, S.; Miyadera, Y. In Polymers for Electronic Applications: Feit, E. D.; Wilkins, C. W., Eds.; ACS Symposium Series 184; American Chemical Society: Washington, DC, 1982; p 123.
Khanna, D. N.; Mueller, W. H. In Proceedings of the 3rd International SAMPE Electronic Materials and Process Conferences: Los Angeles, CA, 1989; p 905.
Ciba-Geigy, “Probimide™ 200 Series”; technical report; 1986.
John, T.; Valenty, V. B. In Proceedings of the 3rd International Conference on Polvimides: SPE: Ellenville, New York, 1988; p 36.
Korshak, V. V.; Rusanov, A. L. In Polymer Yearbook 3: Pethrick, R. A.; Zaikov, G. E., Eds.; Harwood: Chur, 1986; p 115.
Voznesenskaya, N. N.; Yarosh, V. N.; Flerova, A. N.; Zaitseva, E. L; Teleshov, E. N.; Pravednikov, A. N. Vvsokomolek. Soyed. 1978, B20, 196.
Moore, J. A.; Mitchell, T. D. J.Polvm. ScL., Polvm. Chem. Ed. 1980, 18, 3029.
(a) Moore, J. A.; Robello, D. R. Macromolecules 1989, 22, 1084.(b) Moore, J. A.; Robello, D. R. Macromolecules 1986. 19, 2667.
Jones, G. Quinolines: Wiley: London, 1977.
Moore, J. A.; Robello, D. R.; Mehta, P. G. In Proceedings of the 3rd International SAMPE Electronic Materials and Process Conferences: Los Angeles, CA, 1989.
(a) Wallenfels, K. Chemia 1966, 20, 203; Chem. Abstr. 1967, 66, 2109. (b) Wallenfels, K.; Friedrich, K.; Rieser, J.; Ertel, W.; Thieme, K. Angew. Chem. Int. Ed. Eng. 1976, 15, 261.
Moore, J. A.; Mehta, Parag. G. Proc. Polvm. Sci. Mat. Eng. 1989, 60, 74.
Moore, J. A.; Mehta, Parag. G. Proc. Polvm. Mat. Eng. Sci. 1990, 62, 351.
Moore, J. A.; Kim, Ji-Heung; Seidel, Peter R. Chem. Mat., in press.
Moore, J. A.; Kim, Ji-Heung Macromolecules. submitted for publication.
Moore, J. A.; Mehta, Parag. G. Macromolecules 1988. 21, 2644.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1992 Springer Science+Business Media New York
About this chapter
Cite this chapter
Moore, J.A. (1992). Poly(Enaminonitriles): New Materials with Interesting Properties. In: Salamone, J.C., Riffle, J.S. (eds) Advances in New Materials. Contemporary Topics in Polymer Science, vol 7. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3456-3_4
Download citation
DOI: https://doi.org/10.1007/978-1-4615-3456-3_4
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-6530-3
Online ISBN: 978-1-4615-3456-3
eBook Packages: Springer Book Archive