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Technology CAD — Computer Simulation of IC Processes and Devices pp 37–85Cite as

Introduction to SUPREM

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Part of the book series: The Springer International Series in Engineering and Computer Science ((SECS,volume 243))

Abstract

While the exact form that VLSI technology would take in the future was uncertain in late 1970s, it seemed evident that costly and time- consuming empirical approaches to developing and optimizing such technology are a luxury few will be able to afford or wish to justify. A far more attractive alternative is the formulation of accurate models of the basic physical processes involved, and their implementation in a comprehensive computer program. Such a program would allow predictions of device structures resulting from any proposed fabrication sequence and would minimize the need for empirical iterative attempts. Since its inception, the process simulator SUPREM has been one such attempt to realize this goal. Beginning with SUPREM I and proceeding to SUPREM II and III, each version has drawn from the models and physical understanding of fabrication processes then available.

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Authors and Affiliations

  1. Stanford University, USA

    Robert W. Dutton

  2. Tsinghua University, China

    Zhiping Yu

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  1. Robert W. Dutton
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  2. Zhiping Yu
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© 1993 Springer Science+Business Media New York

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Dutton, R.W., Yu, Z. (1993). Introduction to SUPREM. In: Technology CAD — Computer Simulation of IC Processes and Devices. The Springer International Series in Engineering and Computer Science, vol 243. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3208-8_2

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  • DOI: https://doi.org/10.1007/978-1-4615-3208-8_2

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-6408-5

  • Online ISBN: 978-1-4615-3208-8

  • eBook Packages: Springer Book Archive

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