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Thin Film Multilayer Interconnection Technologies for Multichip Modules

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Multichip Module Technologies and Alternatives: The Basics

Abstract

Historically there has been a wide gap between the feature geometries on integrated circuits (ICs) (typically —1 pm) and those of IC packages and printed wiring boards (PWBs) (typically 50-100 pm). To achieve the ultimate density and speed in electronic systems, this gap must be closed, and it is inevitable that the thin film processes used to fabricate ICs will be required for IC packaging. In recent years, there has been active development of thin film multilayer (TFML) structures to provide high density interconnections between ICs in multichip modules (MCMs). The materials, processes, and designs for TFML interconnections are the focus of this chapter.

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Authors
  1. Ronald J. Jensen
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Daryl Ann Doane Paul D. Franzon

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© 1993 Springer Science+Business Media New York

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Jensen, R.J. (1993). Thin Film Multilayer Interconnection Technologies for Multichip Modules. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_7

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  • DOI: https://doi.org/10.1007/978-1-4615-3100-5_7

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-442-01236-6

  • Online ISBN: 978-1-4615-3100-5

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