Abstract
In the design of electronics packaging systems, there is rarely a single “best” solution; the final design is usually a tradeoff between different performance attributes (system speed, thermal constraints or size) and cost. In many cases, tradeoffs between cost and performance are the most important. Unfortunately, the analysis of cost and performance tradeoffs is a very complex task. On the performance end, the vast variety of design options available today to the packaging engineer precludes an exhaustive analysis of all viable alternatives. On the cost end, the treatment usually is even more cursory because of the complexity and uncertainty of cost before actual production.
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Ng, L.H. (1993). MCM Package Selection: Cost Issues. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_4
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DOI: https://doi.org/10.1007/978-1-4615-3100-5_4
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