Abstract
There are a large number of packaging alternatives available to the design engineer today. This range is not likely to narrow in the near future. The object of this chapter is to provide a framework of understanding for making packaging decisions with the perspective of how best to satisfy the needs of an electronic system.
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Franzon, P.D. (1993). MCM Package Selection: A Systems Need Perspective. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_3
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DOI: https://doi.org/10.1007/978-1-4615-3100-5_3
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