Abstract
This is a book about multichip modules (MCMs). And the strategies involved in implementing them successfully! The book discusses the technology alternatives appropriate for MCMs, and the decision-making processes required for choosing the “best” technology for a particular application. The book helps to answer the question: Is the technology applicable (or appropriate) to the design goal?
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
R. R. Tummala, E. J. Rymaszewski, eds., Microelectronics Packaging Handbook, New York: Springer Science+Business Media New York, 1989.
D. P. Seraphim, R Lasky, C. Y. Li, Principles of Electronic Packaging, New York: McGraw-Hill, 1989.
R. W. Johnson, R. K. Teng, J. W. Balde, eds., Multichip Modules: System Advantages,Major Construction, and Materials Technologies, New York: IEEE Press Reprint Book, 1991.
G. Messner, I. Turlik, J. Balde, P. Garrou, eds., Thin Film Multichip Modules, Reston VA: ISHM, 1992.
J. J. Licari, L. R. Enlow, Hybrid Microcircuit Technology Handbook, Park Ridge NJ: Noyes Publications, 1988.
C. A. Harper, ed., Electronic Packaging and Interconnection Handbook, New York: McGraw-Hill, 1991.
C. A. Harper, ed., Handbook of Thick Film Microelectronics, New York: McGraw-Hill, 1982.
M. L. Dertouzos, R. K. Lester, R. M. Solow, Made In America: Regaining The Productive Edge, New York: Harper Perennial, 1989.
K. B. Clark, T. Fujimoto, Product Development Performance-Strategy, Organization, and Management in the World Auto Industry, Boston MA: Harvard Business School Press, 1991.
J. W. Daily, Packaging of Electronic Systems (A Mechanical Engineering Approach), New York: McGraw-Hill, 1990.
H. B. Bakoglu, Circuits,Interconnections, and Packaging for VLSI, Reading MA: Addison-Wesley, 1990.
J. S. Hwang, Solder Pastes in Electronics Packaging, New York: Springer Science+Business Media New York, 1989.
J. H. Lau, ed., Solder Joint Reliability: Theory and Applications, New York: Springer Science+Business Media New York, 1991.
C. F. Coombs, Jr, Printed Circuits Handbook-3rd Ed., New York: McGraw-Hill, 1988.
E. D. Littie, P. S. Ho, R. Jaccodine, K. Jackson, eds., Electronic Packaging Materials Science V, MRS Symposium Proceedings Nov. 1990, vol. 203, Pittsburgh PA: Materials Research Society, 1991.
E. D. Littie, R. C. Sundahl, R. Jaccodine, K. A. Jackson, eds., Electronic Packaging Materials Science IV, MRS Symposium Proceedings April 1989, vol. 154, Pittsburgh PA: Materials Research Society, 1989.
Publication IPC-MC-790, “Guideline for Multichip Technology Utilization”, IPC (Institute for Interconnecting and Packaging Electronic Circuits), Lincolnwood, IL, 1990.
J. J. Reche, “High Density Interconnect for Advanced Packaging,” Proc. NEPCON West, (Anaheim CA), pp. 1308–1318, Feb. 1989. See also:
W. H. Knausenberger and L.W. Schaper, “Interconnection Costs of Various Substrates - The Myth of Cheap Wire,” IEEE Trans. CHMT, vol. CHMT-3, no. 4, pp. 634–637, Dec. 1980.
A. J. Blodgett, Jr., “Microelectronic Packaging,” Scientific American, vol. 249, pp. 86–96, July 1983.
A. J. Blodgett, Jr., “A Multilayer Ceramic Multichip Module,” IEEE Trans. CHMT, vol. CHMT-3, no. 4, pp. 634–637, Dec. 1980.
For a more recent article giving the background as well as the latest information on the glass ceramic/copper multilayer substrates for the IBM 390/9000 high performance computers see:
A. H. Kumar, R. R. Tummala, “State-of-the-Art, Glass-Ceramic/Copper Multilayer Substrate for High Performance Computers,” Int. J. Hybrid Microelectronics, vol. 14, no. 4, pp. 137–150, Dec. 1991.
L. M. Higgins III, et al., “Glob-Top Encapsulant Suitability for Large Wire Bonded Die on MCM-L,” Proc. Int. Conf. Multichip Modules, (Denver CO), pp. 482–484, April 1992.
M. L. Dertouzos, R. K. Lester, R. M. Solow and The MIT Commission on Industrial Productivity, Made in America: Regaining the Productive Edge, New York: Harper Perennial (A Division of Harper Collins Publishers), 1989.
Electronic Engineering Times, May 4, 1992.
W. Blood, “ASIC Design Methodology for Multichip Modules,” Hybrid Circuit Techn., vol. 8, pp. 21–27, Dec. 1991.
J. L. Hennessy, “Trends in Processor and System Design and the Interaction with Advanced Packaging,” Proc. IEEE Multichip Module Conference MCMC-92, (Santa Cruz CA), pp. 1–3, March 1992.
J. W. Balde, “Crisis in Technology: The Questionable Ability to Make Thin Film Multichip Modules,” Proc. of the IEEE, Dec. 1992.
E. Jan Vardaman, “Economic and Political Implications of Disinvestment in the MCM Industry,” Proc. Int. Conf. Multichip Modules, (Denver CO), pp. 71–73, April 1992.
F. Bachner, et al., “Defining the Interface between Suppliers and Users in the Multichip Module Marketplace,” Proc. Int. Conf. Multichip Modules, (Denver CO), pp. 52–55, April 1992.
L. M. Higgins III, “Perspectives on Multi-Chip Modules: Substrate Alternative,” Proc. IEEE Multichip Module Conference MCMC-92, (Santa Cruz CA), pp. 12–15, March 1992.
B. Freyman, B. Miles, “A DSP-based Multichip Module employing Advanced Multilayer Printed Circuit Board Technology,” Proc. Int. Conf Multichip Modules, (Denver CO), p. 490, April 1992.
W. M. Siu, “MCM and Monolithic VLSI: Perspectives on Dependencies, Integration, Performance and Economics,” Proc. IEEE Multichip Module Conference MCMC-92, (Santa Cruz CA), pp. 4–7, March 1992.
Editor information
Rights and permissions
Copyright information
© 1993 Springer Science+Business Media New York
About this chapter
Cite this chapter
Doane, D.A. (1993). Introduction. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_1
Download citation
DOI: https://doi.org/10.1007/978-1-4615-3100-5_1
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-01236-6
Online ISBN: 978-1-4615-3100-5
eBook Packages: Springer Book Archive