Abstract
Ever since its invention, the density and performance of the integrated circuit have been increasing at an exponential rate, fueled by improvements in processing, devices, circuit design and layout techniques. This has led to dramatic improvements in the size, speed and cost of electronic systems. Unfortunately, not all of the components of these systems have kept pace with the integrated circuit. The speed and density of today’s VLSI chips are so high that IC packages now present a bottleneck for increasing system speed and shrinking system size.
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© 1994 Springer Science+Business Media New York
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Sriram, M., Kang, S.M. (1994). Introduction. In: Physical Design for Multichip Modules. The Springer International Series in Engineering and Computer Science, vol 267. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-2682-7_1
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DOI: https://doi.org/10.1007/978-1-4615-2682-7_1
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-6153-4
Online ISBN: 978-1-4615-2682-7
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