Abstract
Heat transfer across the interface between copper and gadolinium gallium garnet (GGG) is enhanced using various materials. These are helium gas, high vacuum grease, high purity indium, and Stycast 2850 FT epoxy. This qualitative study is conducted for temperatures between 2 K and 10 K. Helium gas improves the conductance of the interface but the improvement is limited by the low thermal conductivity of the gas. High vacuum grease improves the conductance less than does helium gas. High purity indium increases the conductance significantly and does not appear to degrade with temperature cycling. Stycast 2850 FT provides a similar improvement in the conductance; however, it can only be used for small area interfaces. A large Cu/GGG interface bonded with epoxy tends to fail when cooled to liquid helium temperatures.
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References
B.P.M. Helvensteijn and A. Kashani, Conceptual design of a 0.1 W magnetic refrigerator for operation between 10 K and 2 K, in: “Advances in Cryogenic Engineering,” Vol. 35B Plenum Press, New York (1989), p. 1115.
L.J. Salerno, P. Kittel and A.L. Spivak, Thermal conductance of pressed copper contacts at liquid helium temperatures, AIAA J., Vol. 22 (1984), p. 1810.
G.A. Slack, D.W. Oliver, Thermal Conductivity of Garnets and Phonon Scattering by Rare-Earth Ions, Phys. Rev. B, Vol. 4 (1971) 592.
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© 1994 Springer Science+Business Media New York
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Helvensteijn, P.M.B., Kashani, A., McCormack, F.J. (1994). Methods for Improving the Transfer of Heat across the Copper and Gadolinium Gallium Garnet Interface. In: Kittel, P. (eds) Advances in Cryogenic Engineering. Advances in Cryogenic Engineering, vol 39. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-2522-6_160
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DOI: https://doi.org/10.1007/978-1-4615-2522-6_160
Publisher Name: Springer, Boston, MA
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