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Semiconductor Device Simulation

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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

Part of the book series: The Springer International Series in Engineering and Computer Science ((SECS,volume 302))

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Abstract

One of the available methodologies to simulate substrate coupling is a semiconductor device simulator such as TMA MEDICI [3.2] or MEDUSA [3.4] which employs numerical techniques to analyze semiconductor device action. In this chapter we discuss an overview of such an approach, its significance and its attributes [3.1].

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Authors and Affiliations

  1. Carnegie Mellon University, USA

    Nishath K. Verghese & David J. Allstot

  2. IBM. Rochester, USA

    Timothy J. Schmerbeck

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  1. Nishath K. Verghese
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  2. Timothy J. Schmerbeck
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  3. David J. Allstot
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Verghese, N.K., Schmerbeck, T.J., Allstot, D.J. (1995). Semiconductor Device Simulation. In: Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits. The Springer International Series in Engineering and Computer Science, vol 302. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-2239-3_3

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  • DOI: https://doi.org/10.1007/978-1-4615-2239-3_3

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-5942-5

  • Online ISBN: 978-1-4615-2239-3

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