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Repair and Rework

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Microelectronics Manufacturing Diagnostics Handbook

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Abstract

Today’s computing systems, with their application of high-density packaging and VLSI devices, represent a marked change from the electronic printed circuit boards made only a few years ago. The development of microminiaturized components, multilayered wiring, very large scale integration, CMOS technology, hybrid components, and multilayered printed circuit boards has created new opportunities for microelectronic applications, but has also created a range of new issues in the area of repair, rework, and modification of microelectronic assemblies and devices.

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Author information

Authors and Affiliations

  1. IBM Corporation, East Fishkill, New York, USA

    Thomas A. Wassick, Cheryl B. Field & C. C. Hu

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  1. Thomas A. Wassick
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  2. Cheryl B. Field
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  3. C. C. Hu
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Abraham H. Landzberg

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© 1993 Springer Science+Business Media New York

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Wassick, T.A., Field, C.B., Hu, C.C. (1993). Repair and Rework. In: Landzberg, A.H. (eds) Microelectronics Manufacturing Diagnostics Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-2029-0_8

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  • DOI: https://doi.org/10.1007/978-1-4615-2029-0_8

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-5840-4

  • Online ISBN: 978-1-4615-2029-0

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