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Laminate/HDI Die Carriers

  • Happy T. Holden
  • Donald Barr
  • Douglas Powell

Abstract

The use of more complex components with very high I/O counts has pushed the board fabricator to re-examine techniques for creating smaller vias. Over the last several years, many new or redeveloped processes have appeared on the market. These processes include revised methods of creating holes, such as laser drilling, micro-punching, and mass etching; new methods for additively creating dielectric with via holes using photo-sensitive dielectric materials; and new methods for metallizing the vias such as conductive adhesives and solid post vias. All of these methods share some common traits. They all allow the designer to significantly increase routing density through the use of vias in SMT pads, to reduce size and weight of product, and to improve the electrical performance of the system. These types of boards are generically called, “High Density Interconnects” or HDI.

Keywords

Design Rule Copper Foil Polyimide Film Laser Drilling Flip Chip 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2001

Authors and Affiliations

  • Happy T. Holden
    • 1
  • Donald Barr
    • 2
  • Douglas Powell
    • 2
  1. 1.Westwood AssociatesUSA
  2. 2.IBM MicroelectronicsUSA

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