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Area Array Interconnection Handbook pp 614–655Cite as

Tape Ball Grid Array

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Abstract

TAPE Ball Grid Array (TBGA) packages are a family of electronic chip carriers that utilize circuitized flex (tape) as the die carrier mounted to a printed circuit card or board. Previously this family of packages has been referred to by several designations, among them: Area Array Tape Automated Bonding (ATAB) [1], Tape Ball Grid Array (TBGA) [2], fleXBGA1 [3], Wire Bond TBGA (WB TBGA) [4], Signetics TBGA (S-TBGA) [5], Flex TBGA (FTBGA) [6], Star BGA [7]. TBGA is by far the most popular acronym utilized for this family of packages and adopted by the Joint Electronic Device Engineering Council of the Electronic Industry Association (JEDEC) for its standard package outlines [8]. Since the chip carrier is circuitized flex, it has been suggested that these packages more appropriately be referred to as Flex BGAs (FBGA) [9]. Since the standards refer to this package family as TBGAs, the terminology is adopted for this chapter.

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Authors and Affiliations

  1. IEEC-SUNY-Binghamton, France

    Frank Andros

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  1. Frank Andros
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Karl J. Puttlitz Paul A. Totta

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© 2001 Springer Science+Business Media New York

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Andros, F. (2001). Tape Ball Grid Array. In: Puttlitz, K.J., Totta, P.A. (eds) Area Array Interconnection Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1389-6_16

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  • DOI: https://doi.org/10.1007/978-1-4615-1389-6_16

  • Publisher Name: Springer, Boston, MA

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