History of Flip Chip and Area Array Technology

  • Paul A. Totta


The concept of interconnecting a chip to a package in a face-down or “flip chip” orientation is simple enough, and forty years old. The idea of having input-output connections all over the face of a flip chip is also a simple idea, and twenty-five years old. Then, how is it, in the last days of the twentieth century, that the electronics industry finds itself in the midst of a revolution in electronic assembly referred to as flip-chip area-array packaging?


Fatigue Life Solder Joint Solder Ball Solder Bump Very Large Scale Integration 
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Copyright information

© Springer Science+Business Media New York 2001

Authors and Affiliations

  • Paul A. Totta
    • 1
  1. 1.IBM MicroelectronicsUSA

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