Abstract
Experiments designed and performed to examine the CMP of blanket BCB and SiLK polymer films are presented in this chapter. The films were polished using Cu CMP slurries to simulate the overpolish step that occurs when all metal and liner materials are removed in the damascene patterning process. Two sets of experiments were performed to determine the controlling factors for polymer CMP removal. The first set of experiments explore the effects of various slurries on polymer removal rates, post-CMP surface roughness, and post-CMP surface and interior chemistry. The second set of experiments investigates the effect of reducing the cure time and temperature on polymer CMP removal rates and post-CMP film hardness and modulus. These results are later combined to develop a physically-based explanation and conceptual model of the CMP process applied to low dielectric constant polymers. The experimental procedures and characterization techniques employed are thoroughly presented in Appendix A. This chapter emphasizes CMP results and a mechanistic understanding.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
C. L. Borst, D. G. Thakurta, R. J. Gutmann, W. N. Gill, J. Electrochem. Soc., 146(11), 4309 (1999).
F. Küchenmeister, Z. Stavreva, U. Schubert, K. Richter, C. Wenzel, Adv. Metal. Conf., Colorado Springs, CO, (1998).
D. Towery and M. Fury, J. Elect. Mat., 27(10), 1088 (1998).
G.-R. Yang, Y.-P. Zhao, J. M. Neirynck, S. P. Murarka, R. J. Gutmann, J. Electrochem. Soc., 144(9), 3249 (1997).
C. L. Borst, W. N. Gill, and R. J. Gutmann, Int. Jml. of Chemical-Mechanical Planarization for On-Chip Interconnection, 1(1), 26 (2000).
F. G. Shi, B. Zhao, Appl. Phys. A, 67, 249 (1998).
C. Rogers, J. Coppeta, L. Racz, A. Philipossian, F. B. Kaufman, D. Brarnono, J. Elect. Mat. 27(10), 1082 (1998).
D. G. Thakurta, C. L. Borst, D. W. Schwendeman, R. J. Gutmann, W. N. Gill, Thin Solid Films, 366, 181 (2000).
C. L. Borst, W. N. Gill, and R. J. Gutmann, Int. Jrnl. of Chemical-Mechanical Planarization for On-Chip Interconnection, 1(1), 26 (2000).
T. F. Thadros (ed.), Surfactants, Academic Press, 1984.
C. L. Borst, Chemical-Mechanical Planarization of Low-Dielectric Constant Polymers in Copper Slurries, M.S. Thesis, Rensselaer Polytechnic Institute, Troy, NY (1999).
J. M. Neirynck, Cu/Polymer Damascene Interconnects: Elimination of High-Resistivity Metallic Liners, Ph.D. Thesis, Rensselaer Polytechnic Institute, Troy, NY (1998).
D. Towery and M. Fury, J. Elect. Mat., 27(10), 1088 (1998).
J. M. Neirynck, G.-R. Yang, S. P. Murarka, R. J. Gutmann, Thin Solid Films 290, 447 (1996).
D. Perrnana, S. P. Murarka, M. G. Lee, S. I. Beilin in: R. Havemann, J. Schmitz, H. Komiyama, K. Tsubouchi, Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, Boston, USA, October 1–3, 1996, Proceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, 539 (1997).
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2002 Springer Science+Business Media New York
About this chapter
Cite this chapter
Borst, C.L., Gill, W.N., Gutmann, R.J. (2002). CMP of BCB and Silk Polymers. In: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1165-6_4
Download citation
DOI: https://doi.org/10.1007/978-1-4615-1165-6_4
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4020-7193-5
Online ISBN: 978-1-4615-1165-6
eBook Packages: Springer Book Archive