Skip to main content
SpringerLink
Log in

Chemical-Mechanical Planarization (CMP)

  • Chapter
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

  • 263 Accesses

Abstract

Chemical-mechanical planarization (CMP) has found application in semiconductor processing as a method of controlling the planarity of the multiple metal and dielectric layers that form the IC interconnect structure [3.1, 3.2]. Nonplanarity is introduced to the wafer surface at the transistor isolation level and increases as the number of metal layers increases. CMP is the process of physically removing material from places of high topography to flatten and level the wafer surface. Figure 3.1 depicts nonplanarity increasing as metal layers increase, while Figure 3.2 depicts the ideal case of planar interconnect layers allowed by CMP.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. J.M. Steigerwald, S.P. Murarka and R.J. Gutmann, Chemical-Mechanical Planarization of Microelectronic Materials, Wiley Interscience (1997).

    Google Scholar 

  2. S. Wolf and R. N. Tauber, Silicon Processing for the VLSI Era. 2nd Edition, CA: Lattice Press (1999).

    Google Scholar 

  3. http://www.ipec.com/cmp/products.htm

  4. F. Zhang, A. Busnaina, Appl. Phys. A, 69, 437 (1999).

    Article  Google Scholar 

  5. G. Zhang, G. Burdick, F. Dai, T. Bibby, S. Beaudoin, Thin Solid Films, 332(1–2), 379 (1998).

    Article  Google Scholar 

  6. M. Eissa, S. Joshi, G. Shinn, S. Rafie, B. Fraser, Proc. Electrochem. Soc, 99-37, 499 (2000).

    Google Scholar 

  7. J. Warnock, J. Electrochem. Soc, 138(8), 2398 (1991).

    Article  MathSciNet  Google Scholar 

  8. J. G. Darab, D. W. Matson, J. Elect. Mat. 27(10), 1068 (1998).

    Article  Google Scholar 

  9. J. M. Steigerwald, S. P. Murarka, R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, New York: J. Wiley & Sons (1997).

    Book  Google Scholar 

  10. L. Cook, J. Non-Cryst. Solids, 120, 152 (1990).

    Article  Google Scholar 

  11. J. A. Trogolo, K. Rajan, J. Mat. Sci., 29, 4554 (1994).

    Article  Google Scholar 

  12. A. Agarwal, M. Tomozawa, W. A. Lanford, J. Non-Cryst. Solids, 167(1–2), 139 (1994).

    Article  Google Scholar 

  13. J. M. Steigerwald, S. P. Murarka, R. J. Gutmann, D. J. Duquette, J. Electrochem. Soc. 141(12), 3512 (1994).

    Article  Google Scholar 

  14. J. M. Steigerwald, S. P. Murarka, D. J. Duquette, R. J. Gutmann, in Advanced Metallization and Interconnect Systems for ULSI Applications in 1994, 173 (1995).

    Google Scholar 

  15. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, H. Deligianni, Proc. Electrochem. Soc, 98-6, 48 (1999).

    Google Scholar 

  16. C. W. Kaanta, S. G. Bombardier, W. J. Cote, W. R. Hill, G. Kerszykowski, H. S. Landis, D. J. Poindexter, C. W. Pollard, G. H. Ross, J. G. Ryan, S. Wolff, J. E. Cronin, 8 th Intl. VLSI Mult, lnterconn. Conf. (V-MIC), June 11–12, Santa Clara, CA 144 (1991).

    Google Scholar 

  17. D. T. Price, R. J. Gutmann, S. P. Murarka, Thin Solid Films, 308–309, 523 (1997).

    Article  Google Scholar 

  18. D. T. Price, Ph.D. Thesis, Dual Damascene Copper Interconnects with Low-κ Polymer Dielectrics, Rensselaer Polytechnic Institute, Troy, NY (1999).

    Google Scholar 

  19. P. K. K. Ho, M.-S. Zhou, S. Gupta, R. Chockalingam, J. Li, M. Fan, Proc. SPIE Int. Soc. Opt. Eng., 3883, 34 (1999).

    Article  Google Scholar 

  20. A. Skumanich, M.-P. Cai, Proc SPIE Int. Soc Opt. Eng., 3883, 96 (1999).

    Article  Google Scholar 

  21. K. Leitner, N. Elbel, K. Koller, Proc. SPIE Int. Soc Opt. Eng., 3214, 58 (1997).

    Article  Google Scholar 

  22. J. Xie, K. Rafftesaeth, S.-F. Huang, J. Jensen, R. Nagahara, P. Parimi, B. Ho, Mater. Res. Soc. Symp. Proc., 566, 223 (2000).

    Article  Google Scholar 

  23. T. Park, T. Tugbawa, D. Boning, S. Hymes, P. Lefevre, T. Brown, K. Smekalin, G. Schwartz, Proc. Electrochem. Soc, 99-37, 94 (2000).

    Google Scholar 

  24. L. Zhong, J. Yang, K. Holland, J. Grillaert, K. Devriend, N. Heylen, M. Meuris, Jpn. J. Appl. Phys. Pt 1, 38(4A), 1932 (1999).

    Article  Google Scholar 

  25. H. Fusstetter, A. Schnegg, D. Graf, H. Kirschner, M. Brohl, P. Wagner, Mater. Res. Soc Symp. Proc., 386, 97 (1995).

    Article  Google Scholar 

  26. L. M. Ge, D. J. Dawson, T. Cunningham, Proc. Electrochem. Soc, 99-9, 238 (1999).

    Google Scholar 

  27. L. Zhang, S. Raghavan, M. Weling, J. Vac. Sci. Technol. B, 17(5), 2248 (1999).

    Article  Google Scholar 

  28. D. Mordo, I. Goswami, I. J. Malik, T. Mallon, R. Emami, B. Withers, Mater. Res. Soc. Symp. Proc., 443, 127 (1997).

    Article  Google Scholar 

  29. W.-T. Tseng, Y.-T. Hsieh, C.-F. Lin, M.-S. Tsai, M.-S. Feng, J. Electrochem. Soc, 144(3), 1100 (1997).

    Article  Google Scholar 

  30. H. M’saad, M. Vellaikal, L. Zhang, D. Witty, Mater. Res. Soc Symp. Proc., 564, 443 (1999).

    Article  Google Scholar 

  31. P. Sermon, K. Beekman, S. McClatchie, Vacuum Solutions, 5, 31 (1999).

    Google Scholar 

  32. I. Lou, P. Lee, J. Ma, T. Poon, C.I. Lang, D. Sugiarto, W. F. Yau, D. Cheung, S. Li, B. Brown, X. Li, M. Naik, 16th Intl. VLSI Mult. Interconn. Conf. (V-MIC), September 7–9, Santa Clara, CA 234 (1999).

    Google Scholar 

  33. S.-Y. Shih, L.-J. Chen, 3rd Intl. Conf. on CMP Planar. (CMP-MIC) Conference, February 19–20, Santa Clara, CA 305 (1999).

    Google Scholar 

  34. L. Forester, D. K. Choi, R. Hosseini, United States Patent No. 5,952,243, Issued September 1999.

    Google Scholar 

  35. W.-C. Chen, C.-T. Yen, J. Vac. Sci. Technol. B, 18(1), 201 (2000)

    Article  Google Scholar 

  36. J.M. Neirynck, S.P. Murarka, R.J. Gutmann, in: T.-M. Lu, S.P. Murarka, T.-S. Kuan, CH. Ting, Low-Dielectric Constant Materials — Synthesis and Applications in Microelectronics, San Francisco, USA, April 17–19, 1995, Mat. Res. Soc Symp. Proc., 381, 229(1995).

    Google Scholar 

  37. J.M. Neirynck, G.-R. Yang, S.P. Murarka, RJ. Gutmann, Thin Solid Films, 290–291, 447 (1996).

    Article  Google Scholar 

  38. D. Permana, S.P. Murarka, M.G. Lee, S. I. Beilin in: R. Havemann, J. Schmitz, H. Komiyama, K. Tsubouchi, Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, Boston, USA, October 1–3, 1996, Proceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, 539 (1997).

    Google Scholar 

  39. Y.L. Tai, Y.L. Wang, 4th Intl. Conf. on CMP Planar. (CMP-MIC) Conference, March 2–3, Santa Clara, CA 379 (2000).

    Google Scholar 

  40. S. Rogojevic, J.A. Moore, W.N. Gill, J. Vac. Sci. Technol. A, 17(1), 266 (1999).

    Article  Google Scholar 

  41. G.-R. Yang, Y.-P. Zhao, J. M. Neirynck, S. P. Murarka, R. J. Gutmann, J. Electrochem. Soc, 144(9), 3249 (1997).

    Article  Google Scholar 

  42. D. Towery and M. Fury, J. Elect. Mat., 27(10), 1088 (1998).

    Article  Google Scholar 

  43. F. Küchenmeister, Z. Stavreva, U. Schubert, K. Richter, C. Wenzel, Adv. Metal. Conf., Colorado Springs, CO, (1998).

    Google Scholar 

  44. F. Küchenmeister, U. Schubert, J. Heeg, C. Wenzel, Proc. of the Intl. Interconn. Techn. Conf. (IITC), May 24–26, San Francisco, CA, 158 (1999).

    Google Scholar 

  45. F. Preston, J. Soc. Glass Technol., 11, 247 (1927).

    Google Scholar 

  46. F. G. Shi, B. Zhao, Appl. Phys. A, 67, 249 (1998).

    Article  Google Scholar 

  47. M. Bushnan, R. Rouse, J. E. Leukens, J. Electrochem. Soc, 142(11), 3845 (1995).

    Article  Google Scholar 

  48. S. R. Runnels, P. Renteln, Proc. Electrochem. Soc, 93-25, 110 (1993).

    Google Scholar 

  49. D, Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin, T. Cale, J. Electrochem. Soc, 144(3), 1121 (1997).

    Article  Google Scholar 

  50. J. Tichy, J. A. Levert, L. Shan, S. Danyluk, J. Electrochem. Soc, 146(4), 1523 (1999).

    Article  Google Scholar 

  51. D. Dornfield, 17th Intl. VLSI Mult. Interconn. Conf(VMIC), 105 (2000).

    Google Scholar 

  52. J. Luo and D. Dornfield, 18th Int. Conf. On Very Large Scale Multilevel Interconnects (VMIC), 281 (2001).

    Google Scholar 

  53. J. Luo and D. Dornfield IEEE Trans. Semiconductor Manufacturing 14(2) 112 2001

    Article  Google Scholar 

  54. J. Coppeta, C. Rogers, A. Philipossian, F. B. Kaufman, 1st Intl. Conf. on CMP Planar. (CMP-MIC) Conference, February 13–14, Santa Clara, CA, 307 (1997).

    Google Scholar 

  55. S. R. Runnels, M. Eyman, J. Electrochem. Soc, 141(5), 1698 (1994).

    Article  Google Scholar 

  56. C. Rogers, J. Coppeta, L. Racz, A. Philipossian, F. B. Kaufman, D. Bramono, J. Elect. Mat., 27(10), 1082 (1998).

    Article  Google Scholar 

  57. S. R. Runnels, J. Electrochem. Soc, 141(7), 1900 (1994).

    Article  Google Scholar 

  58. S. Sundararajan, D. G. Thakurta, D. W. Schwendeman, S. P. Murarka, W. N. Gill, J. Electrochem. Soc, 146(2), (1999).

    Google Scholar 

  59. D. G. Thakurta, C. L. Borst, D. W. Schwendeman, R. J. Gutmann, W. N. Gill, Thin Solid Films, 366, 181 (2000).

    Article  Google Scholar 

  60. E. Paul, J. Electrochem. Soc, 148, G355 (2001).

    Article  Google Scholar 

  61. E. Paul, J. Electrochem. Soc, 148, G359 (2001).

    Article  Google Scholar 

  62. R.J. Gutmann, D.J. Duquette, P.S. Dutta and W.N. Gill, 6th Intl. Conf. On CMP Planar. (CMP-MIC) Conference, 81 (2001).

    Google Scholar 

  63. H. S. Fogler, Elements of Chemical Reaction Engineering, 2 nd Edition, New Jersey: Prentice Hall (1992).

    Google Scholar 

  64. C. N. Hinshelwood, The Kinetics of Chemical Change, Oxford: Clarendon Press (1940)

    Google Scholar 

  65. A. J. Roosmalen, Vacuum, 34(3–4), 429 (1984).

    Article  Google Scholar 

  66. H. Ishii, Y. Takahashi, J. Electrochem. Soc, 135(6), 1539 (1988).

    Article  Google Scholar 

  67. S. M. Hsu, R. L. Kabel, AICHEJrnl., 20(4), 713 (1974).

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Texas Instruments, Inc., Dallas, TX, USA

    Christopher L. Borst

  2. Rensselaer Polytechnic Institute, Troy, NY, USA

    William N. Gill & Ronald J. Gutmann

Authors
  1. Christopher L. Borst
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. William N. Gill
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Ronald J. Gutmann
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

Copyright information

© 2002 Springer Science+Business Media New York

About this chapter

Cite this chapter

Borst, C.L., Gill, W.N., Gutmann, R.J. (2002). Chemical-Mechanical Planarization (CMP). In: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-1165-6_3

Download citation

  • DOI: https://doi.org/10.1007/978-1-4615-1165-6_3

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4020-7193-5

  • Online ISBN: 978-1-4615-1165-6

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation