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Nanotribology pp 177-184 | Cite as

Surface Characteristics of Integrated MEMS in High-Volume Production

  • Jack Martin

Abstract

In the early 1970’s, silicon pressure sensors were considered to be the leading edge of a micromachining technology that would revolutionize industrial instrumentation. This new technology did grow. However, commercialization was slower than anticipated — delays arose due to quality, cost, lack of standardization and difficulties related to electronic integration. Many of the quality problems were caused by surface instabilities.

Keywords

Wafer Level Ceramic Package Diphenyl Siloxane Wafer Coating Differential Capacitor 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2003

Authors and Affiliations

  • Jack Martin
    • 1
  1. 1.Micromachined Products DivisionAnalog Devices, Inc.CambridgeUSA

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