Surface Characteristics of Integrated MEMS in High-Volume Production
In the early 1970’s, silicon pressure sensors were considered to be the leading edge of a micromachining technology that would revolutionize industrial instrumentation. This new technology did grow. However, commercialization was slower than anticipated — delays arose due to quality, cost, lack of standardization and difficulties related to electronic integration. Many of the quality problems were caused by surface instabilities.
KeywordsWafer Level Ceramic Package Diphenyl Siloxane Wafer Coating Differential Capacitor
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