Abstract
Fluorocaibon (FC) liquids are now interested in the field of electrical insulation technologies, since their vapors, under some conditions, show higher dielectric strength than that of SF 6 gas and their polymerized films show high breakdown strength.1–5 They show, also, zero ozone depletion and fewer greenhouse potentials, and are nonflammable and highly resistant against thermal breakdown. C x F y polymer films composed of fluorine and carbon made by FC are known for their chemical inertness, gpod electrical stability, and low dielectric constants.3,4,6,7 The main disadvantages of FC for application of electrical insulator were of their low saturation vapor pressure, and their poor adhesion on substrates as a film. However, plasma enhanced chemical vapor deposition (PECVD) for film formation has provided many advantages that overcome these problems. In this case C x F y films contain strong C-F bonds that decrease the dielectric constant and cross-linked C-C structure that sustains high thermal stability, accordingly they show high hydrophobicity, good adhesion, and high stability in high temperature environment.7,8
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Sakai, Y. (2001). Application of Fluorocarbon Vapor to Electrical Insulation. In: Christophorou, L.G., Olthoff, J.K. (eds) Gaseous Dielectrics IX. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0583-9_39
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DOI: https://doi.org/10.1007/978-1-4615-0583-9_39
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