Abstract
The 80’s was the MCM era, when we all thought that multi-chip modules (MCM) were going to be the next big package innovation. MCMs were going to be the next big package innovation. MCMs were going to revolutionize packaging across the board from high end computing and military applications all the way to consumer products. Infrastructure limitations at that time, most notably IC and substrate test and yields prevented these MCMs from reaching their full potential.
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© 2003 Springer Science+Business Media New York
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Tessier, T. (2003). 3D Packaging Technologies: Are Flex Based Solutions the Answer?. In: Balde, J.W. (eds) Foldable Flex and Thinned Silicon Multichip Packaging Technology. Emerging Technology in Advanced Packaging Series, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0231-9_9
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DOI: https://doi.org/10.1007/978-1-4615-0231-9_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-7923-7676-7
Online ISBN: 978-1-4615-0231-9
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