Low-Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon — The European FLEX-SI Project

  • Thomas Harder
  • Wolfgang Reinert
Part of the Emerging Technology in Advanced Packaging Series book series (ADEP, volume 1)


Today there is a strong trend towards thin and flexible packages which is driven by different industrial applications e.g. smart cards and electronic labels. Furthermore, several technical approaches for ultra-thin chip stacking leading to 3D assemblies are followed. In the European FLEX-SI Project (IST-99-10205) the eight partners Philips Semiconductors (A), W.S.I. (F), Datacon (A), Nokia (FIN), Oticon (DK), PAV CARD (D), Helsinki University of Technology (FIN) and Fraunhofer ISIT (D) are working together on an industrial approach of low-profile packaging with ultra-thin silicon chips.


Smart Card Solder Bump Flip Chip Electroless Copper Scan Acoustic Microscopy 
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Copyright information

© Springer Science+Business Media New York 2003

Authors and Affiliations

  • Thomas Harder
    • 1
  • Wolfgang Reinert
    • 1
  1. 1.Fraunhofer Institute for Silicon Technology (ISIT)ItzehoeGermany

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