Low-Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon — The European FLEX-SI Project
Today there is a strong trend towards thin and flexible packages which is driven by different industrial applications e.g. smart cards and electronic labels. Furthermore, several technical approaches for ultra-thin chip stacking leading to 3D assemblies are followed. In the European FLEX-SI Project (IST-99-10205) the eight partners Philips Semiconductors (A), W.S.I. (F), Datacon (A), Nokia (FIN), Oticon (DK), PAV CARD (D), Helsinki University of Technology (FIN) and Fraunhofer ISIT (D) are working together on an industrial approach of low-profile packaging with ultra-thin silicon chips.
KeywordsQuartz Foam Shipping Epoxy Brittle
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- T. Harder, W. Reinert ‘Low-profile flip chip assembly using ultra-thin ICs’, 13thEuropean Microelectronics & Packaging Conference (IMAPS), 30.05. - 01.06.2001, StrassbourgGoogle Scholar
- H. Pristauz ‘Handling concepts for ultra-thin wafers’, 13thEuropean Microelectronics & Packaging Conference (IMAPS), 30.05. - 01.06.2001, StrassbourgGoogle Scholar
- G. Hillmann, W. Reinert (ISIT) ‘Automatic assembly of ultra-thin chips’, Thin Semiconductor Devices — Manufacturing and Applications, Fraunhofer IZM, Munich, December 2001Google Scholar
- T. Harder ‘Low-profile and flexible electronic assemblies using ultra-thin silicon — the European FLEX-SI Project“ at the planary session on foldable flex and thinned silicon at the International Conference on Advanced Packaging and Systems (ICAPS 2002, March 2002 in Reno)Google Scholar
- T.F. Waris, J.K. Kivilahti ‘Manufacturing of flexible integrated module boards’, IMAPS Nordic 2002Google Scholar