Abstract
This book has presented the state of the technology for thinned silicon chips on thin flexible substrates. The resultant assemblies can be so thin they can be placed on a substrate with metal traces over the chips. They can be placed on strips of flexible tape circuits and tested before folding the flex into the stacked assembly.
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© 2003 Springer Science+Business Media New York
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Balde, J.W. (2003). Conclusion. In: Balde, J.W. (eds) Foldable Flex and Thinned Silicon Multichip Packaging Technology. Emerging Technology in Advanced Packaging Series, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0231-9_14
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DOI: https://doi.org/10.1007/978-1-4615-0231-9_14
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-7923-7676-7
Online ISBN: 978-1-4615-0231-9
eBook Packages: Springer Book Archive