Abstract
The multichip, foldable package technology requires high-density and compact metallized substrates, thus offering an ideal new set of applications for flex circuits. Fine-featured flex circuits have traditionally been made with polyimide filins (25-76 micron typical thickness), but a new process has recently been developed with an alternative substrate -- liquid crystal polymer (LCP). Fine lines and spaces and dielectric features for advanced circuit designs equivalent to cutting-edge polyimide circuit features and not previously attainable with LCP substrates can now be produced on LCP. Flex circuits made from LCP use an adhesiveless, roll-to-roll process flow similar to that used for polyimide substrates, including vacuum metallization, additive plating and chemical etching of the dielectric.
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Yang, R., Hayden, T.F. (2003). Recent Advancements in Flex Circuit Technology Using Liquid Crystal Polymer Substrates. In: Balde, J.W. (eds) Foldable Flex and Thinned Silicon Multichip Packaging Technology. Emerging Technology in Advanced Packaging Series, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0231-9_11
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DOI: https://doi.org/10.1007/978-1-4615-0231-9_11
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