Abstract
Flexible circuit interconnect has been an enabling technology in a wide range of applications, including automotive, industrial, military and aerospace, computer, telecommunication, consumer, and medical products. Flexible circuit or tape automated bonding (TAB) has also been a key interconnect for IC packages. Over the last few years the industry has expanded, and growth in the high density interconnect (HDI) segment of the market promises to exceed that of the traditional material in dollar value.
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References
Dominique Numakura, “Introduction of High Density Flexible Circuits,” Nikkan Kogyo Shinbun, Tokyo, Japan, December 1998.
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© 2003 Springer Science+Business Media New York
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Vardaman, E.J., Numakura, D. (2003). Availability of High Density Interconnect Flexible Circuits. In: Balde, J.W. (eds) Foldable Flex and Thinned Silicon Multichip Packaging Technology. Emerging Technology in Advanced Packaging Series, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-0231-9_10
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DOI: https://doi.org/10.1007/978-1-4615-0231-9_10
Publisher Name: Springer, Boston, MA
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