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Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging

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Abstract

High reliability and durability are two of the important requirements for a commercially used semiconductor laser. There are multiple causes for the semiconductor laser to fail during operation. Therefore, it is important to analyze and identify the root causes for laser failures and provide effective solutions to improve the reliability and durability of the semiconductor laser. In this chapter, different failure modes of semiconductor lasers are introduced. By analyzing these failure modes, some approaches to improve reliability of the semiconductor laser are demonstrated. The lifetime prediction of the semiconductor lasers is also presented.

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Liu, X., Zhao, W., Xiong, L., Liu, H. (2015). Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging. In: Packaging of High Power Semiconductor Lasers. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9263-4_9

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  • DOI: https://doi.org/10.1007/978-1-4614-9263-4_9

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-9262-7

  • Online ISBN: 978-1-4614-9263-4

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