Abstract
Despite the many advances in manufacturing of high power semiconductor lasers, the basic packaging process has not been changed significantly. This chapter reviews the steps used to package and assemble high power semiconductor laser with open packages and fiber-coupled modules. The fabrication procedure of open packages contains a sequence of processes, which involve incoming materials inspection, raw materials cleaning, metallization, solder deposition, die bonding, wire bonding, assembling, screening, before burn-in (BBI) test, burn in (BI), after burn-in (ABI) test, and final inspection. The details are presented in Sects. 7.1–7.10. Fiber-coupled modules typically use an open package, optics, and a fiber to couple the light into the fiber. The packaging process for fiber-coupled module is introduced in Sect. 7.11.
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Liu, X., Zhao, W., Xiong, L., Liu, H. (2015). Packaging Process of High Power Semiconductor Lasers. In: Packaging of High Power Semiconductor Lasers. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9263-4_7
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