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Materials in High Power Semiconductor Laser Packaging

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Packaging of High Power Semiconductor Lasers

Abstract

The performance of semiconductor lasers is greatly affected by the properties of packaging materials, which mainly consist of diverse bonding solders, mounting substrates [1–4]. The selection of packaging materials is multidisciplinary and involves achieving a balance among device performance, reliability, manufacturability, and cost-effectiveness. In this chapter, the properties of solder materials, as well as mounting substrates employed in the packaging of high power semiconductor lasers are presented and the effects of material properties on the performance of semiconductor lasers are analyzed in details.

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Authors and Affiliations

  1. Focuslight Technologies Co., Ltd, Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences, Shaanxi, People’s Republic of China

    Xingsheng Liu

  2. Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences, Shaanxi, People’s Republic of China

    Wei Zhao, Lingling Xiong & Hui Liu

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  1. Xingsheng Liu
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  2. Wei Zhao
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  4. Hui Liu
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Liu, X., Zhao, W., Xiong, L., Liu, H. (2015). Materials in High Power Semiconductor Laser Packaging. In: Packaging of High Power Semiconductor Lasers. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9263-4_6

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  • DOI: https://doi.org/10.1007/978-1-4614-9263-4_6

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