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Development Trend and Challenges in High Power Semiconductor Laser Packaging

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Packaging of High Power Semiconductor Lasers

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Abstract

Driven by lower cost, longer lifetime, and new applications, the requirements of high power semiconductor lasers have been changing and the demand for new products has been accelerated in recent years. As a result, the packaging technologies for high power semiconductor lasers have been advanced rapidly and have become more sophisticated. In this chapter, we review and discuss the technology development trend of high power semiconductor lasers, including single emitters, bars, horizontal bar arrays, and vertical bar stacks. The packaging technology is still one of the bottlenecks of the advancement of high power semiconductor lasers. We will discuss the challenges and issues in high power laser packaging and some approaches and strategies in addressing the challenges and issues will be presented. The application and price trend are also discussed briefly in this chapter.

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Authors and Affiliations

  1. Focuslight Technologies Co., Ltd, Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences, Shaanxi, People’s Republic of China

    Xingsheng Liu

  2. Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences, Shaanxi, People’s Republic of China

    Wei Zhao, Lingling Xiong & Hui Liu

Authors
  1. Xingsheng Liu
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  2. Wei Zhao
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  3. Lingling Xiong
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  4. Hui Liu
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Liu, X., Zhao, W., Xiong, L., Liu, H. (2015). Development Trend and Challenges in High Power Semiconductor Laser Packaging. In: Packaging of High Power Semiconductor Lasers. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9263-4_11

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  • DOI: https://doi.org/10.1007/978-1-4614-9263-4_11

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  • Online ISBN: 978-1-4614-9263-4

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