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Supression Effect and Additive Chemistry

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Copper Electrodeposition for Nanofabrication of Electronics Devices

Part of the book series: Nanostructure Science and Technology ((NST))

Abstract

The excellent additive systems for acid copper sulfate bath developed in the 1960s successfully produce bright copper deposits with smooth surfaces and high ductility. Since then, many applications of copper plating were developed for electronic device and through-hole plating for PCBs as well as conventional decorative plating on steel, electroforming, etc.

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Author information

Authors and Affiliations

  1. Osaka Prefecture University, 8-15 Taishi-Cho, Kawachi Nagano Shi, 586-0041, Japan

    Masayuki Yokoi

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  1. Masayuki Yokoi
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Correspondence to Masayuki Yokoi .

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Editors and Affiliations

  1. Dept. of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. Intel Corporation, Hillsboro, Oregon, USA

    Rohan N. Akolkar

  3. Dept. of Chemical Engineering, University of New Hampshire, Durham, New Hampshire, USA

    Dale P. Barkey

  4. Industrial Technology Support Institute, Osaka Prefecture, Japan

    Masayuki Yokoi

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Yokoi, M. (2014). Supression Effect and Additive Chemistry. In: Kondo, K., Akolkar, R., Barkey, D., Yokoi, M. (eds) Copper Electrodeposition for Nanofabrication of Electronics Devices. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9176-7_2

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