Traffic- and Thermal-Aware Routing Algorithms for 3D Network-on-Chip (3D NoC) Systems

  • Kun-Chih Chen
  • Chih-Hao Chao
  • Shu-Yen Lin
  • An-Yeu (Andy) Wu


Three-dimensional Network-on-Chip (3D NoC) has been proposed to solve the complex on-chip communication issues in future 3D multicore systems. However, the thermal problems of 3D NoC are more serious than 2D NoC due to stacking dies. To keep the temperature below a certain thermal limit, many approaches of run-time thermal management were proposed. In this chapter, we will introduce some design concepts of traffic- and thermal-aware routing algorithms, which aim at minimize the performance impact caused by the run-time thermal managements. The investigative approaches can mitigate the design challenges of 3D NoC systems. Without the enhancement of cooling devices, the 3D NoC system can still be thermal-safe. Besides, the advantages of 3D integration are preserved, because the thermal-limited performance back-off is reduced.


Maximal Throughput Thermal Limit Lateral Path Path Diversity Achievable Throughput 
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Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  • Kun-Chih Chen
    • 1
  • Chih-Hao Chao
    • 1
  • Shu-Yen Lin
    • 1
  • An-Yeu (Andy) Wu
    • 1
  1. 1.Graduate Institute of Electronics EngineeringNational Taiwan UniversityTaipeiTaiwan

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